Eduardo Rojas-Nastrucci, chair of the Department of Electrical Engineering and Computer Science at Embry-Riddle Aeronautical University, will give the talk on 3D-printed antennas and electronics. Over the last decade, the complexity of radiofrequency (RF) component packaging has increased, driven by, for example, the integration of multiple semiconductor dies into compact, high-performance systems. This evolution has spurred demand for advanced manufacturing approaches capable of supporting intricate planar and 3D architectures, high-temperature operation and the incorporation of metasurfaces. This presentation delves into the current landscape of advanced manufacturing and 3D electromagnetic modeling for heterogeneous RF components and metasurfaces. It highlights emerging trends and technologies that are reshaping the field, with a focus on the convergence of material science, modeling techniques and fabrication innovations. From an engineering standpoint, progress in RF packaging hinges on the synergy between high-fidelity electromagnetic modeling and the development of novel conductive and dielectric materials engineered to reduce losses and endure thermal stress. Equally critical is the implementation of cutting-edge manufacturing processes tailored to the demands of heterogeneous integration. Key discussion points will include recent advancements in additive manufacturing techniques such as micro-dispensing, two-photon polymerization, femtosecond laser machining and aerosol jetting. These methods enable the fabrication of multilayer, conformal structures with precise electromagnetic and mechanical properties. The talk will also showcase practical applications, including 3D conformal metasurface antennas, illustrating their transformative impact on next-generation wireless systems. About Rojas: He is the chair for the Department of Electrical Engineering and Computer Science at Embry-Riddle Aeronautical University (ERAU), Daytona Beach. He joined the university in 2017, where he also serves as a professor of electrical and computer engineering. He is the founder and co-director of ERAU’s Wireless Devices and Electromagnetics Laboratory (WIDE Lab). He received a National Science Foundation CAREER Award in 2019; a 2022 Jet Propulsion Laboratory Faculty Fellowship; the 2020 Most Promising Engineer Award, Ph.D. and Education category, from the Great Minds in Stem (GMiS) organization; ERAU’s 2021 Abas Sivjee Outstanding Research Award; ERAU’s 2024 and 2025 Innovation Awards; the IEEE MTT-S 2026 Outstanding Young Engineer Award and is a senior member of the National Academy of Inventors.